PEEK-GF20 vs. PPS-GF20 for electrical applications

High-voltage components & circuit board holders in FFF 3D printing

At a glance

→ PEEK-GF20 and PPS-GF20 are the preferred materials for high-performance electrical applications in FFF 3D printing.

→ Crucial factors: temperature requirement, tracking resistance (CTI), flame retardancy class and cost sensitivity

→ FFF/FDM is the right process for these component classes — geometric complexity with manageable batch size

→ Malping processes both materials on industrial FFF systems with PCD nozzles.

Why use glass fiber reinforced high-performance polymers in electrical engineering?

Electrical and electronic components place demands on their materials that quickly push conventional engineering plastics such as PA6, ABS, or PC to their limits: high continuous operating temperatures, defined tracking resistance, flame retardancy according to UL 94, and mechanical stability even under the influence of moisture. This is precisely where glass fiber-reinforced high-performance polymers come into play.

PEEK-GF20 (polyetheretherketone with 20% glass fiber) and PPS-GF20 (polyphenylene sulfide with 20% glass fiber) are established materials in electrical engineering and both can now be reliably processed using FFF 3D printing.

This opens up completely new possibilities: customer-specific insulators, circuit board holders and connector housings that would be expensive or time-consuming to produce using traditional manufacturing methods.

This article systematically compares PEEK-GF20 and PPS-GF20 with a view to typical electrical applications such as high-voltage components and circuit board holders, and provides clear decision-making support for material selection.

PEEK-GF20 vs. PPS-GF20: The most important properties compared

The following table compares the material properties relevant for electrical applications. All values refer to printed components (FFF); mass-produced injection-molded components may differ.

Characteristic	PEEK-GF20	PPS-GF20
fiber optic component	20 wt.%	20 wt.%
Continuous operating temperature	up to 260 °C	up to 220 °C
Tracking resistance (CTI)	≥ 100 (PTI)	≥ 600 (PLC 0)
Flame retardant class (UL 94)	V-0 (1.5 mm)	V-0 (0.8 mm)
Tensile strength	approx. 120–140 MPa	approx. 90–110 MPa
E-module	approx. 8–10 GPa	approx. 7–9 GPa
density	approx. 1.35 g/cm³	approx. 1.45 g/cm³
Water absorption (23 °C/50%RH)	< 0.3%	< 0.02%
Chemical resistance	Very high	High
Media resistance (oils/fats)	Very high	High
Processing temperature (FFF)	approx. 390–420 °C	approx. 310–360 °C
Print bed temperature (FFF)	approx. 120–160 °C	approx. 100–130 °C
Filament material costs	500–700 €/kg	150–250 €/kg
Price/performance ratio	★★★☆☆	★★★★★
Typical application area	High voltage, high temperature	PCB holders, standard HV

¹ CTI according to IEC 60112; ² Tensile strength ISO 527 (printed specimens, printing direction XY); ³ Filament prices Malping purchasing as of 2025

High-voltage applications: Leakage resistance as a key property

What does tracking resistance (CTI) mean?

The Comparative Tracking Index (CTI) describes a plastic's resistance to the formation of conductive tracking paths on its surface, a safety-critical parameter in high-voltage technology. The higher the CTI value, the better.

PPS-GF20 achieves a CTI ≥ 600 (PLC 0) and is therefore in the highest tracking resistance class — ideal for HV applications up to approximately 1 kV nominal voltage. PEEK-GF20 typically has a CTI ≥ 100 (PTI class) — sufficient for many applications, but requires careful testing for very high voltage classes.

Typical high-voltage components in FFF 3D printing

• Insulators and insulating pieces in switch cabinets and control systems

• Coil carriers and winding bodies for transformers and relays

• Busbar mounts and cable guides for > 400 V

• Connector housings and contact carriers in charging technology (EV sector)

• Sensor mounts in HV environments (vehicle, industry)

For high-voltage applications below 1 kV, PPS-GF20 is in most cases the more economically viable choice : equally good or better CTI value, very good flame retardancy (UL 94 V-0 from 0.8 mm wall thickness) — at significantly lower material costs. PEEK-GF20 is justified when additional requirements include extreme temperatures (> 220 °C continuous load), mechanical wear resistance, or special chemical resistance.

PCB holders: dimensional stability, fit and reproducibility

Requirements profile for circuit board holders

PCB holders must be manufactured reproducibly, as the hole pattern and mounting geometry must precisely match the circuit board. Typical requirements:

• Dimensional stability: low tendency to warp, defined tolerances

• Electrical insulation: no conductivity, sufficient tracking resistance

• Temperature resistance: often increased operating temperature due to power dissipation from adjacent components

• Ease of assembly: Snap connections, screw bosses, insert parts

• Flame retardancy: UL 94 V-0 often required, especially for power supplies and power electronics

PPS-GF20 perfectly meets the requirements for circuit board holders : excellent tracking resistance (PLC 0), UL 94 V-0 even with thin wall thicknesses, very low moisture absorption (< 0.02%) for dimensionally stable fits—all at a fraction of the cost of PEEK-GF20. For standard applications up to approximately 150–180 °C, PPS-GF20 is the economically superior choice.

When is PEEK-GF20 used for circuit board holders?

PEEK-GF20 is chosen for circuit board holders when:

• The operating temperature is permanently > 200 °C (e.g. near power modules or in high-temperature furnaces)

• Aggressive cleaning agents or solvents are used against which PPS shows weaknesses

• Sterilizability (e.g., steam sterilization) is required

• Particularly high mechanical load peaks occur — PEEK-GF20 has the higher tensile strength

Why FFF/FDM is the right process for these component classes

High-voltage components and circuit board holders share a characteristic feature in practice: they are often geometrically complex and, at the same time, rarely required in large production volumes. This is precisely what plays into FFF's hands.

FFF enables: component complexity without tooling costs, fast design iterations (First Article in days instead of weeks), economical batch sizes of 1–1000 pieces, and the direct processing of certified high-performance polymers.

Compared to FGF granule printing (which excels in very large components and high production volumes), FFF offers clear advantages for this component class: higher detail resolution, finer wall thicknesses, better reproducibility for small features, and PEEK-GF20 and PPS-GF20 are available as industrial-grade filaments.

FFF processing instructions for PEEK-GF20 and PPS-GF20

→ PEEK-GF20: Printing temperature 390–420 °C, bed 120–160 °C, closed heating chamber required

→ PPS-GF20: Printing temperature 310–360 °C, bed 100–130 °C, closed heating chamber recommended

→ Both materials: PCD (polycrystalline diamond) nozzles are mandatory for abrasive fiberglass compounds

→ Drying before printing: PEEK-GF20 min. 4–6 h at 150 °C, PPS-GF20 min. 4 h at 120 °C

→ Optimal layer thickness: 0.10–0.20 mm for electrically relevant detail geometries

Decision matrix: PEEK-GF20 or PPS-GF20?

Application scenario	PEEK-GF20	PPS-GF20
High voltage > 1 kV (continuous operation)	✅ First choice	⚠️ Check
High voltage < 1 kV	✅ Possible	✅ First choice
Circuit board holder (standard)	⚠️ Oversized	✅ First choice
PCB holder (high temperature)	✅ First choice	⚠️ Border area
Humid environment / Condensation	✅ Very good	✅ Very good
Aggressive chemicals	✅ Very good	✅ Good
Weight-critical components	✅ Lighter	⚠️ Heavier
Cost-sensitive project	⚠️ More expensive	✅ Cheaper
Sterilizability (steam)	✅ Possible	✅ Possible
UL 94 V-0 for thin wall thicknesses	⚠️ From 1.5 mm	✅ From 0.8 mm

✅ = recommended / first choice | ⚠️ = possible, but consultation recommended | Information applies to FFF-printed components

Practical examples from everyday Malping life

Example 1: High-voltage insulating piece for industrial frequency converter

A machine manufacturer needed a custom-made insulating piece for the high-voltage input section of a frequency converter (600 V DC). Requirements included UL 94 V-0, CTI Class PLC 0, and an operating temperature of up to 130 °C. The geometry, with integrated cable channels and asymmetrical connectors, was complex for conventional CNC manufacturing.

Material: PPS-GF20 via FFF — Delivery time 4 working days from approval, including quality inspection. The component met all electrical and mechanical requirements in the first-article test.

Example 2: Circuit board holders for power electronics test setup

An electronics company needed 12 different circuit board adapter holders for a test bench operating at high ambient temperatures (> 160 °C). Standard holders made of PA or PC failed due to warping.

Material: PPS-GF20 for 9 of 12 variants, PEEK-GF20 for 3 variants with temperatures > 200 °C – a cost-optimized mixing strategy that was only economically feasible through 3D printing without tooling requirements.

Example 3: Sensor mount in the vehicle's high-voltage system

A temperature and pressure sensor mount was developed for an automotive supplier in the high-voltage battery area. Requirements: continuous operating temperature of 220 °C, resistance to electrolyte vapors, UL 94 V-0.

Material: PEEK-GF20; the superior chemical resistance and high-temperature stability justified the higher price compared to PPS-GF20.

FAQ — Frequently Asked Questions

Are PEEK-GF20 and PPS-GF20 certified for high-voltage applications using FFF 3D printing?

The materials themselves are UL-94 listed. For printed components in safety-critical high-voltage systems, component-specific qualification (e.g., according to IEC 61439 or customer requirements) is required by the user. Malping provides complete material certificates and test reports upon request.

What are the minimum wall thicknesses achievable with PEEK-GF20 and PPS-GF20 in FFF printing?

In practice, wall thicknesses from approximately 0.5 mm (1 perimeter) can be reliably produced. For electrically relevant insulation gaps, we recommend a wall thickness of at least 1.5–2.0 mm to eliminate process-related pores.

Can Malping also produce larger series of circuit board holders?

Yes, FFF is economical for up to approximately 1000 units per variant. For larger production runs, we recommend a cost comparison with injection molding or granulate 3D printing (FGF). Malping provides transparent advice to help you decide whether to make or buy.

How do PEEK-GF20 and unfilled PEEK differ for electrical applications?

Unfilled PEEK has lower stiffness and higher toughness. Due to its glass fiber content, PEEK-GF20 offers a higher modulus of elasticity and better dimensional stability under heat. For dimensionally stable brackets and structural components, the GF20 variant is almost always preferable. The CTI value is comparable for both.

How long does it take to deliver prototypes?

Standard delivery time for FFF prototypes made of PEEK-GF20 or PPS-GF20: 10 working days from order confirmation and approved CAD data. Express deliveries (3-4 working days) are also possible.

Conclusion: The right material for your electrical application

PEEK-GF20 and PPS-GF20 are complementary materials, not competitors. The choice depends on temperature requirements, tracking class, flame retardancy, and cost sensitivity. As a rule of thumb:

• PPS-GF20: Standard high voltage and PCB mounting up to 200 °C. Excellent CTI, best cost-performance ratio.

• PEEK-GF20: When additional extreme temperatures, chemical resistance or maximum mechanical strength are required.

Your next step

→ Send STEP file and/or PDF drawing to: info@malping.de

→ We check geometry and material suitability free of charge — and recommend the optimal material

→ We will respond to your offer or inquiries within 24 hours (working days)

→ malping.de

About the author: Dr.-Ing. Bastian Gaedike is the founder and managing director of Malping GmbH (brand: Materialpinguin) in Neuhausen auf den Fildern. The materials scientist, who holds a doctorate, specializes in the processing of high-performance polymers using FFF and FGF (granulate printing) as well as their CNC post-processing.

PPS-GF20 in 3D printing: Electrical insulating plastic for circuit board frames and electronic applications

Ein Hochvolt-Stecker aus Natur-PEEK und ein Verbindungsbauteil aus PPS-GF20.

Why PPS-GF20 is increasingly in demand in the electronics sector

Anyone looking for 3D-printed housing parts, circuit board frames or connector housings in the electronics and power electronics sector quickly encounters a dilemma: Standard thermoplastics such as PA12 or ABS are often insufficient in terms of thermal or chemical properties – PEEK, on the other hand, is expensive and over-dimensioned for many series applications.

This is precisely where PPS-GF20 (polyphenylene sulfide with 20% glass fibers) positions itself as a technically compelling and economically attractive solution. The material combines electrical insulation, flame retardancy, temperature stability up to 220 °C, and excellent chemical resistance – at a fraction of the cost of PEEK.

Malping processes PPS-GF20 using both FFF (filament printing) and FGF granule printing on the AIM3D ExAM 510. For larger circuit board frames or serial parts, granule printing is significantly more cost-effective than filament printing.

Overview of the material properties of PPS-GF20

PPS is a semi-crystalline, high-performance thermoplastic that has been used in the electronics industry for decades as an injection molding compound. The 20% glass fiber reinforcement (GF20) significantly increases stiffness and dimensional stability compared to unfilled PPS.

Electrical and thermal characteristics

• Contact resistance: >10¹⁵ Ω·cm – reliable electrical insulation even under the influence of moisture

• Dielectric constant: ~3.5 at 1 MHz – advantageous for RF-like applications

• Continuous operating temperature: 200–220 °C – sufficient for most PCB assemblies

• Short-term temperature: up to 260 °C – relevant for reflow soldering processes (lead-free solder)

• Flame retardancy: UL 94 V-0 without additives – meets common standards for electronic enclosures

Mechanical properties

• E-modulus: ~9 GPa – significantly stiffer than natural PEEK (~4 GPa), close to PEEK-GF20

• Tensile strength: ~130–150 MPa – suitable for load-bearing frame structures

• Creep tendency: very low – Dimensional stability even under continuous load and heat

• Water absorption: <0.05% – negligible, important for electrical properties

Electronics applications: circuit board frames, connector housings and more

The combination of electrical insulation, flame retardancy and temperature resistance makes PPS-GF20 a prime example material for the following electronics applications in 3D printing:

PCB frames and PCB carriers

PCB frames made of PPS-GF20 reliably insulate PCBs from the housing ground and adjacent assemblies. The high modulus of elasticity prevents warping under thermal load: a common problem with PA-based frames. Unlike milled epoxy resin parts, 3D printing allows undercuts, cable routing, and connector recesses to be integrated into a single component.

Typical application example: Power electronics module with multiple PCBs, where each board is fixed in its own PPS-GF20 frame and electrically separated from the aluminum housing.

Connector housing and contact carrier

PPS-GF20 meets the requirements of IEC 60335 and similar standards for contact carriers without any additional additives. Its low water absorption ensures consistent dielectric properties even in humid environments (e.g., automotive, industrial automation).

• Individual pieces and small series for prototypes and special connections

• Spare parts for discontinued connector housings (Digital Inventory)

• Versatile connectors with multiple contact rows without tooling costs

Insulation bushings, spacers and cable guides

Insulating bushings between screws and PCBs are a classic application. FFF/FGF 3D printing enables the rapid production of customer-specific geometries – from simple cylinders to complex cable entry plates with integrated clip systems.

Heat-dissipating structures (with PPS-CF as an alternative)

For applications requiring both insulation and defined heat dissipation, PPS-CF (carbon fiber reinforced) is a suitable option – however, it then exhibits conductive properties that necessitate separate evaluation. PPS-GF20 remains the material of choice when electrical insulation is the top priority.

PPS-GF20 vs. PEEK: When to use which material?

PEEK is the best-known high-performance polymer in 3D printing – but not always the right one. The following table shows the most important differences for electronics applications:

Characteristic	PPS-GF20	PEEK (natural)	Relevance of electronics
continuous temperature	220 °C	250 °C	Reflow soldering up to 260 °C*
E-module	~9 GPa	~4 GPa (natural)	Frame's dimensional stability
Dielectric constant	~3.5 @ 1 MHz	~3.2 @ 1 MHz	RF isolation
Contact resistance	>10¹⁵ Ω·cm	>10¹⁵ Ω·cm	PCB insulation
Flame retardancy	UL 94 V-0	UL 94 V-0	Housing, frame
Chemical resistance	very good	excellent	Cleaning, flux
Material costs	~100 €/kg	500–700 €/kg	Cost lever

* Short-term temperatures during reflow soldering require individual testing; PPS-GF20 may reach its limits with lead-free solder (260 °C peak).

When PPS-GF20 is the better choice

• Continuous operation up to 220 °C

• Cost optimization: PPS-GF20 filament costs approximately €100/kg vs. €500–700/kg for PEEK filament

• High stiffness required: PPS-GF20 significantly outperforms natural PEEK in terms of modulus of elasticity.

• Series applications and larger production volumes, where material costs directly impact part costs

• UL 94 V-0 without flame retardant additives

When PEEK is the better choice

• Continuous operation >220 °C or short-term use up to 300+ °C (e.g. directly on power semiconductors)

• Highest chemical resistance, e.g. against aggressive cleaning agents in medical technology

• If standards or specifications explicitly require PEEK

• Biocompatibility requirements (ISO 10993)

If you are unsure: Malping provides technical advice and prepares quotes for both materials for direct comparison.

CNC post-processing

For precise fits on connector pins, screw holes, or PCB surfaces, Malping combines FGF printing with CNC post-processing under one roof. Tolerances down to ±0.05 mm are thus achievable for functionally critical contact surfaces – without outsourcing to a second service provider.

FAQ – Frequently Asked Questions about PPS-GF20 in 3D Printing

Is PPS-GF20 suitable for PCB frames?

Yes – PPS-GF20 offers excellent electrical insulation (>10¹⁵ Ω·cm), UL 94 V-0 flame retardancy and sufficient temperature stability for most electronic applications up to 220 °C continuous use.

When is PEEK a better choice than PPS-GF20?

PEEK is useful at continuous temperatures >220 °C (e.g. reflow soldering environments), highest chemical requirements, or when standards explicitly require PEEK.

What tolerances are achievable?

With CNC post-processing, Malping achieves tolerances down to ±0.05 mm – relevant for precisely fitting connector housings and circuit board frames. Without post-processing, the tolerance is ±0.1 mm.

Is GF20 electrically conductive?

No – glass fibers (GF) are electrically insulating. Only CF variants (carbon fiber reinforced) would be conductive; PPS-GF20 remains an insulating material.

Request PPS-GF20 components – circuit board frames, connector housings, insulation parts

Malping supplies PPS-GF20 components from individual prototypes to small series production – via FFF filament printing or FGF granule printing, optionally with CNC post-processing for fit dimensions.

► Request a quote now, no obligation: info@malping.de

► Request a material comparison of PEEK vs. PPS-GF20

Neuhausen auf den Fildern (near Stuttgart) | malping.de | #MATERIALPENGUIN

PEEK vs. ULTEM vs. PPS-GF20

Which high-performance polymer is suitable for my application?

Ein Bauteil aus PPS-GF. Hergestellt mittels FGF (Granulatdruck).

Introduction: Three materials, one crucial choice

Anyone wanting to manufacture highly stressed plastic components using 3D printing will sooner or later face the same question: PEEK, ULTEM (PEI) or PPS? All three are considered high-performance thermoplastics – but there are significant differences in processability, cost, thermal stability and application profile.

This article provides a technically sound, practical comparison of the three materials, including actual characteristic values from datasheets and clear recommendations for typical industrial application scenarios. Malping processes all three materials using both FFF and FGF pellet printing on the AIM3D ExAM 510.

The three materials in profile

1. PEEK – the undisputed king of high performance

Polyetheretherketone (PEEK) is the highest-performing polymer readily available for 3D printing. It combines excellent mechanical properties, exceptional chemical resistance, biocompatible special grades, and a continuous operating temperature of up to 250 °C, all at a comparatively low weight.

Malping's portfolio includes PEEK in three variants: natural (unfilled), GF20 (glass fiber reinforced), and CF30 (carbon fiber reinforced) . For high-volume production and large components, Malping relies on FGF pellet printing, which uses granules instead of filament – reducing material costs from €500–700/kg (filament) to €80–150/kg (granules).

Challenge: PEEK requires printing temperatures of 380–420 °C as well as a heated build chamber and places the highest demands on printer hardware and process parameters.

2. ULTEM 9085 (PEI) – the strong PEEK alternative

Polyetherimide (PEI), specifically the ULTEM 9085 variant, is the standard for additive manufacturing in the aerospace industry. The material meets the FAR 25.853 standard for Flame, Smoke and Toxicity (FST) – a certification that is virtually indispensable in aircraft construction. Like all PEI types, ULTEM 9085 is amorphous and has no defined melting point.

Compared to ULTEM 1010, 9085 has a lower glass transition temperature of ~186 °C (vs. ~217 °C) and no FDA approval for food contact – but it does have the FST certification, crucial for industrial 3D printing, and higher impact strength. It is by far the most widely used PEI material in industrial FFF manufacturing.

Challenge: ULTEM 9085 is sensitive to aggressive solvents, halogenated compounds, and concentrated acids. Its mechanical properties—especially stiffness and tensile strength—are significantly lower than those of PEEK, limiting its use in structurally highly stressed components. Furthermore, its water absorption (~1.1%) is higher than that of PEEK and PPS-GF20.

3. PPS-GF20 – the underestimated cost winner

Polyphenylene sulfide (PPS) with 20% glass fiber reinforcement is the most underrated material in this trio. PPS offers inherent chemical resistance comparable to PEEK in certain media (e.g., strong acids) and achieves UL94 V-0 at a wall thickness of just 1.5 mm.

The printing temperature, at 310–350 °C, is significantly lower than that of PEEK or ULTEM, making the process more accessible and saving energy. Water absorption is exceptionally low at 0.11% (equilibrium value at 70% RH, 23 °C) – an advantage in humid or wet environments.

For automotive and electronics applications where electrical insulation (surface resistance > 10¹² Ω, dielectric strength 6.05 kV/mm) and dimensional accuracy are paramount, PPS-GF20 is often the most economical choice.

Challenge: PPS-GF20 is not biocompatible and is unsuitable for medical applications. Furthermore, its HDT (heat transfer temperature) of 1.8 MPa (125.8 °C after annealing at 130 °C) is significantly lower than that of PEEK. Post-annealing at 230 °C can increase the HDT to up to 219.6 °C. The glass fiber requires wear-resistant dies (steel or PCD-tipped).

Key performance indicator comparison at a glance

The following table is based on manufacturer data sheets (Ensinger TECAFIL, 3DXTech FibreX, Fiberon PPS-GF20) and Malping's internal test results. All values refer to 3D-printed test specimens (XY plane, annealed).

Characteristic	PEEK (CF30)	ULTEM 9085 (PEI)	PPS-GF20
density	1.30–1.43 g/cm³	1.34 g/cm³	1.36 g/cm³
Glass transition temperature (Tg)	~143 °C	~186 °C	95 °C
Melting point	~343 °C	-	279.6 °C
HDT (0.45 MPa)	~250–280 °C	~153 °C	236.3 °C*
HDT (1.8 MPa)	~200–230 °C	~130 °C	125.8 °C*
Tensile strength (XY)	~150–200 MPa	~71 MPa	64.1 MPa
Traction E-modulus (XY)	~13,000 MPa	~2,540 MPa	4,552 MPa
Flexural strength (XY)	~220–260 MPa	~115 MPa	102.3 MPa
Bending modulus (XY)	~12,000 MPa	~2,690 MPa	4,111 MPa
Charpy (XY, notched)	~10–15 kJ/m²	~5–8 kJ/m²	7.3 kJ/m²
Water absorption	<0.1%	~1.1%	0.11%
Flame retardant	UL94 V-0	UL94 V-0 + FAR 25.853	UL94 V-0
Chemical resistance	Excellent	Medium	Very good
Biocompatibility	Yes	No	No
Pressure temperature	380–420 °C	350–390 °C	310–350 °C
Filament price level	High	Medium-High	Medium
FGF granules available	Yes	Yes	Yes

* PPS-GF20: HDT values after annealing at 130 °C. After annealing at 230 °C, HDT (0.45 MPa / 1.8 MPa) rises to 248.9 °C / 219.6 °C.

Application profile: When which material?

Material selection depends on three key factors: continuous thermal stress, mechanical requirements, and regulatory framework. The following decision matrix provides initial guidance.

Application scenario	PEEK	ULTEM 9085	PPS-GF20
Continuous operating temperature > 200 °C	✅ First choice	❌ Not suitable	⚠️ Only glowed
High mechanical load (CF variant)	✅ First choice	➖ Average	➖ Average
Medical technology / Implants	✅ Best option	❌ Not suitable	❌ Not suitable
Chemical environment / solvents	✅ Excellent	⚠️ Restricted	✅ Very good
Electrical Insulation (UL94 V-0)	✅ Yes	✅ Yes	✅ Yes
Aerospace (FAR 25.853 FST)	⚠️ Possible	✅ First choice	❌ Not certified
Large-volume components (FGF)	✅ Ideal	✅ Well suited	✅ Well suited
Cost-sensitive serial parts	❌ Expensive	⚠️ Medium	✅ Cheapest option
Automotive / Electronics	✅ Possible	✅ Possible	✅ First choice

Detailed analysis by industry

Mechanical engineering and plant engineering

High-temperature applications with static and dynamic loads are the core area of expertise for PEEK CF30. Bearings, sliding rings, guide elements, and housing components that are continuously operated above 150 °C cannot be covered by PPS-GF20. ULTEM is borderline suitable for structural components in this context.

For voluminous machine components with a component volume of approximately 300 cm³ or more, Malping's FGF technology is clearly economically advantageous: The cost benefit from pellet granules adds up considerably for larger production runs.

Electrical engineering and electronics

All three materials achieve UL94 V-0. PPS-GF20 is often the first choice here: low printing temperature, very good electrical insulation (dielectric strength 6.05 kV/mm, surface resistance > 10¹² Ω), low moisture absorption, and comparatively low material costs make PPS the efficiency champion in this segment. ULTEM 9085 is the mandatory solution as soon as FAR 25.853 FST compliance is required.

For applications involving extreme temperatures or aggressive cleaning media, PEEK remains the only option.

Medical technology

PEEK (natural color) is a standard material in medical technology: It is biocompatible, sterilizable (steam, EtO, gamma radiation), and proven in applications near implants. ULTEM 9085 is not suitable for this segment – those requiring medical approvals should use ULTEM 1010 (FDA/NSF approved) or PEEK medical grade. PPS-GF20 is completely unsuitable for this segment.

Chemical industry and laboratory technology

PPS-GF20 exhibits excellent resistance to most acids, alkalis, and organic solvents – making it almost on par with PEEK. For components subjected to high chemical stress where extreme temperatures are not present, PPS-GF20 is the more economical choice. ULTEM is significantly more susceptible to concentrated acids and halogenated solvents – this should be taken into account when selecting the material.

Printability and process requirements

The processability differs considerably and affects not only the part quality but also the economic costs.

PEEK

• Printing temperature: 380–420 °C

• Heated build chamber required (> 100 °C)

• Abrasive CF/GF variants require wear-resistant nozzles

• FGF printing possible: AIM3D ExAM 510 (510×510×400 mm build volume)

• Drying: essential (< 0.1% moisture before printing)

ULTEM 9085 (PEI)

• Printing temperature: 350–390 °C

• Heated build chamber recommended (≥ 70 °C)

• Amorphous – low warpage, but no chemical resistance to solvents

• FAR 25.853 FST certification – prerequisite for aerospace use

• No annealing required for standard applications

PPS-GF20

• Printing temperature: 310–350 °C

• Print bed: 80–90 °C, room temperature build chamber possible

• Wear-resistant nozzle (steel/ruby) absolutely necessary

• Drying: 100 °C / 10 h before printing; < 20% relative humidity during storage

• Glow heating at 130 °C / 10 h recommended; at 230 °C for maximum HDT

• Shrinkage: XY approx. 0.35–0.49%, Z approx. 0.25–0.28% (after annealing)

Economic efficiency: Cost overview

Material costs are only one part of the overall calculation. Processing costs, scrap rates, and rework also play a role.

PEEK filament: 500-700 €/kg | PEEK granules (FGF): 80-120 €/kg

ULTEM 9085 filament: €150–280/kg | Granules: €30–100/kg, limited availability

PPS-GF20 filament: €110–150/kg | cheaper than ULTEM and significantly cheaper than PEEK

For large-volume components (> 300 cm³), Malping's FGF granulate printing with the AIM3D ExAM 510 offers the greatest economic advantage. With PEEK granulate, the pure material costs are around 80% lower than the filament price – while simultaneously offering a significantly larger build volume (104 liters vs. ~27 liters for FFF systems).

→ You can read more about the economic viability of FGF here .

Conclusion: No material is universal

PEEK, ULTEM and PPS-GF20 are not interchangeable alternatives – they are complementary materials with clearly defined strengths.

• PEEK is the first choice when maximum thermal, mechanical and chemical resistance is required – and in medical technology there is no alternative.

• ULTEM 9085 is an aerospace-certified material (FAR 25.853 FST) and is the industrial FFF standard for aerospace and transportation applications with flame retardancy requirements.

• PPS-GF20 is the economic champion for automotive, electronics and chemically stressed environments – with excellent electrical insulation and lowest pressure temperature in a trio.

Malping processes all three materials in series – using FFF for precise small components and FGF pellet printing for bulky components up to 510×510×400 mm. We offer free consultation on material selection.

Submit your inquiry now: Contact

Our PEEK 3D printing guide: Guide

More information about FGF granule printing: Granules

FAQ – Frequently Asked Questions

Can PPS-GF20 replace PEEK?

For applications with continuous temperatures up to approximately 120 °C and without biocompatibility requirements, PPS-GF20 is an economically viable alternative. Above this limit or in cases of extreme mechanical demands, PEEK remains the better choice.

Is ULTEM 9085 better than PEEK?

Not generally. ULTEM 9085's decisive advantage lies in its FAR 25.853 certification for aerospace applications and its easier processing. PEEK is superior in almost all mechanical and thermal properties and remains the only option for high-temperature and biocompatibility requirements. ULTEM 9085 is not a thermal alternative to PEEK. Its operating temperature of approximately 170 °C is significantly lower than that of PEEK (approximately 260 °C).

Which material has the best chemical resistance?

PEEK and PPS-GF20 perform at a comparably high level. PPS-GF20 can even have an advantage with certain concentrated alkalis or organic solvents. ULTEM is more susceptible to halogenated solvents and concentrated acids.

Why do I need a wear-resistant nozzle for FGF printing with PPS-GF20?

The glass fibers in PPS-GF20 are highly abrasive. Standard brass nozzles are significantly worn down within a few hours, leading to dimensional deviations and quality problems. For all glass fiber and carbon fiber reinforced materials, Malping recommends only hardened steel nozzles or PCD-tipped nozzles.