PEEK-GF20 vs. PPS-GF20 for electrical applications

High-voltage components & circuit board holders in FFF 3D printing

At a glance

→ PEEK-GF20 and PPS-GF20 are the preferred materials for high-performance electrical applications in FFF 3D printing.

→ Crucial factors: temperature requirement, tracking resistance (CTI), flame retardancy class and cost sensitivity

→ FFF/FDM is the right process for these component classes — geometric complexity with manageable batch size

→ Malping processes both materials on industrial FFF systems with PCD nozzles.

Why use glass fiber reinforced high-performance polymers in electrical engineering?

Electrical and electronic components place demands on their materials that quickly push conventional engineering plastics such as PA6, ABS, or PC to their limits: high continuous operating temperatures, defined tracking resistance, flame retardancy according to UL 94, and mechanical stability even under the influence of moisture. This is precisely where glass fiber-reinforced high-performance polymers come into play.

PEEK-GF20 (polyetheretherketone with 20% glass fiber) and PPS-GF20 (polyphenylene sulfide with 20% glass fiber) are established materials in electrical engineering and both can now be reliably processed using FFF 3D printing.

This opens up completely new possibilities: customer-specific insulators, circuit board holders and connector housings that would be expensive or time-consuming to produce using traditional manufacturing methods.

This article systematically compares PEEK-GF20 and PPS-GF20 with a view to typical electrical applications such as high-voltage components and circuit board holders, and provides clear decision-making support for material selection.

PEEK-GF20 vs. PPS-GF20: The most important properties compared

The following table compares the material properties relevant for electrical applications. All values refer to printed components (FFF); mass-produced injection-molded components may differ.

Characteristic	PEEK-GF20	PPS-GF20
fiber optic component	20 wt.%	20 wt.%
Continuous operating temperature	up to 260 °C	up to 220 °C
Tracking resistance (CTI)	≥ 100 (PTI)	≥ 600 (PLC 0)
Flame retardant class (UL 94)	V-0 (1.5 mm)	V-0 (0.8 mm)
Tensile strength	approx. 120–140 MPa	approx. 90–110 MPa
E-module	approx. 8–10 GPa	approx. 7–9 GPa
density	approx. 1.35 g/cm³	approx. 1.45 g/cm³
Water absorption (23 °C/50%RH)	< 0.3%	< 0.02%
Chemical resistance	Very high	High
Media resistance (oils/fats)	Very high	High
Processing temperature (FFF)	approx. 390–420 °C	approx. 310–360 °C
Print bed temperature (FFF)	approx. 120–160 °C	approx. 100–130 °C
Filament material costs	500–700 €/kg	150–250 €/kg
Price/performance ratio	★★★☆☆	★★★★★
Typical application area	High voltage, high temperature	PCB holders, standard HV

¹ CTI according to IEC 60112; ² Tensile strength ISO 527 (printed specimens, printing direction XY); ³ Filament prices Malping purchasing as of 2025

High-voltage applications: Leakage resistance as a key property

What does tracking resistance (CTI) mean?

The Comparative Tracking Index (CTI) describes a plastic's resistance to the formation of conductive tracking paths on its surface, a safety-critical parameter in high-voltage technology. The higher the CTI value, the better.

PPS-GF20 achieves a CTI ≥ 600 (PLC 0) and is therefore in the highest tracking resistance class — ideal for HV applications up to approximately 1 kV nominal voltage. PEEK-GF20 typically has a CTI ≥ 100 (PTI class) — sufficient for many applications, but requires careful testing for very high voltage classes.

Typical high-voltage components in FFF 3D printing

• Insulators and insulating pieces in switch cabinets and control systems

• Coil carriers and winding bodies for transformers and relays

• Busbar mounts and cable guides for > 400 V

• Connector housings and contact carriers in charging technology (EV sector)

• Sensor mounts in HV environments (vehicle, industry)

For high-voltage applications below 1 kV, PPS-GF20 is in most cases the more economically viable choice : equally good or better CTI value, very good flame retardancy (UL 94 V-0 from 0.8 mm wall thickness) — at significantly lower material costs. PEEK-GF20 is justified when additional requirements include extreme temperatures (> 220 °C continuous load), mechanical wear resistance, or special chemical resistance.

PCB holders: dimensional stability, fit and reproducibility

Requirements profile for circuit board holders

PCB holders must be manufactured reproducibly, as the hole pattern and mounting geometry must precisely match the circuit board. Typical requirements:

• Dimensional stability: low tendency to warp, defined tolerances

• Electrical insulation: no conductivity, sufficient tracking resistance

• Temperature resistance: often increased operating temperature due to power dissipation from adjacent components

• Ease of assembly: Snap connections, screw bosses, insert parts

• Flame retardancy: UL 94 V-0 often required, especially for power supplies and power electronics

PPS-GF20 perfectly meets the requirements for circuit board holders : excellent tracking resistance (PLC 0), UL 94 V-0 even with thin wall thicknesses, very low moisture absorption (< 0.02%) for dimensionally stable fits—all at a fraction of the cost of PEEK-GF20. For standard applications up to approximately 150–180 °C, PPS-GF20 is the economically superior choice.

When is PEEK-GF20 used for circuit board holders?

PEEK-GF20 is chosen for circuit board holders when:

• The operating temperature is permanently > 200 °C (e.g. near power modules or in high-temperature furnaces)

• Aggressive cleaning agents or solvents are used against which PPS shows weaknesses

• Sterilizability (e.g., steam sterilization) is required

• Particularly high mechanical load peaks occur — PEEK-GF20 has the higher tensile strength

Why FFF/FDM is the right process for these component classes

High-voltage components and circuit board holders share a characteristic feature in practice: they are often geometrically complex and, at the same time, rarely required in large production volumes. This is precisely what plays into FFF's hands.

FFF enables: component complexity without tooling costs, fast design iterations (First Article in days instead of weeks), economical batch sizes of 1–1000 pieces, and the direct processing of certified high-performance polymers.

Compared to FGF granule printing (which excels in very large components and high production volumes), FFF offers clear advantages for this component class: higher detail resolution, finer wall thicknesses, better reproducibility for small features, and PEEK-GF20 and PPS-GF20 are available as industrial-grade filaments.

FFF processing instructions for PEEK-GF20 and PPS-GF20

→ PEEK-GF20: Printing temperature 390–420 °C, bed 120–160 °C, closed heating chamber required

→ PPS-GF20: Printing temperature 310–360 °C, bed 100–130 °C, closed heating chamber recommended

→ Both materials: PCD (polycrystalline diamond) nozzles are mandatory for abrasive fiberglass compounds

→ Drying before printing: PEEK-GF20 min. 4–6 h at 150 °C, PPS-GF20 min. 4 h at 120 °C

→ Optimal layer thickness: 0.10–0.20 mm for electrically relevant detail geometries

Decision matrix: PEEK-GF20 or PPS-GF20?

Application scenario	PEEK-GF20	PPS-GF20
High voltage > 1 kV (continuous operation)	✅ First choice	⚠️ Check
High voltage < 1 kV	✅ Possible	✅ First choice
Circuit board holder (standard)	⚠️ Oversized	✅ First choice
PCB holder (high temperature)	✅ First choice	⚠️ Border area
Humid environment / Condensation	✅ Very good	✅ Very good
Aggressive chemicals	✅ Very good	✅ Good
Weight-critical components	✅ Lighter	⚠️ Heavier
Cost-sensitive project	⚠️ More expensive	✅ Cheaper
Sterilizability (steam)	✅ Possible	✅ Possible
UL 94 V-0 for thin wall thicknesses	⚠️ From 1.5 mm	✅ From 0.8 mm

✅ = recommended / first choice | ⚠️ = possible, but consultation recommended | Information applies to FFF-printed components

Practical examples from everyday Malping life

Example 1: High-voltage insulating piece for industrial frequency converter

A machine manufacturer needed a custom-made insulating piece for the high-voltage input section of a frequency converter (600 V DC). Requirements included UL 94 V-0, CTI Class PLC 0, and an operating temperature of up to 130 °C. The geometry, with integrated cable channels and asymmetrical connectors, was complex for conventional CNC manufacturing.

Material: PPS-GF20 via FFF — Delivery time 4 working days from approval, including quality inspection. The component met all electrical and mechanical requirements in the first-article test.

Example 2: Circuit board holders for power electronics test setup

An electronics company needed 12 different circuit board adapter holders for a test bench operating at high ambient temperatures (> 160 °C). Standard holders made of PA or PC failed due to warping.

Material: PPS-GF20 for 9 of 12 variants, PEEK-GF20 for 3 variants with temperatures > 200 °C – a cost-optimized mixing strategy that was only economically feasible through 3D printing without tooling requirements.

Example 3: Sensor mount in the vehicle's high-voltage system

A temperature and pressure sensor mount was developed for an automotive supplier in the high-voltage battery area. Requirements: continuous operating temperature of 220 °C, resistance to electrolyte vapors, UL 94 V-0.

Material: PEEK-GF20; the superior chemical resistance and high-temperature stability justified the higher price compared to PPS-GF20.

FAQ — Frequently Asked Questions

Are PEEK-GF20 and PPS-GF20 certified for high-voltage applications using FFF 3D printing?

The materials themselves are UL-94 listed. For printed components in safety-critical high-voltage systems, component-specific qualification (e.g., according to IEC 61439 or customer requirements) is required by the user. Malping provides complete material certificates and test reports upon request.

What are the minimum wall thicknesses achievable with PEEK-GF20 and PPS-GF20 in FFF printing?

In practice, wall thicknesses from approximately 0.5 mm (1 perimeter) can be reliably produced. For electrically relevant insulation gaps, we recommend a wall thickness of at least 1.5–2.0 mm to eliminate process-related pores.

Can Malping also produce larger series of circuit board holders?

Yes, FFF is economical for up to approximately 1000 units per variant. For larger production runs, we recommend a cost comparison with injection molding or granulate 3D printing (FGF). Malping provides transparent advice to help you decide whether to make or buy.

How do PEEK-GF20 and unfilled PEEK differ for electrical applications?

Unfilled PEEK has lower stiffness and higher toughness. Due to its glass fiber content, PEEK-GF20 offers a higher modulus of elasticity and better dimensional stability under heat. For dimensionally stable brackets and structural components, the GF20 variant is almost always preferable. The CTI value is comparable for both.

How long does it take to deliver prototypes?

Standard delivery time for FFF prototypes made of PEEK-GF20 or PPS-GF20: 10 working days from order confirmation and approved CAD data. Express deliveries (3-4 working days) are also possible.

Conclusion: The right material for your electrical application

PEEK-GF20 and PPS-GF20 are complementary materials, not competitors. The choice depends on temperature requirements, tracking class, flame retardancy, and cost sensitivity. As a rule of thumb:

• PPS-GF20: Standard high voltage and PCB mounting up to 200 °C. Excellent CTI, best cost-performance ratio.

• PEEK-GF20: When additional extreme temperatures, chemical resistance or maximum mechanical strength are required.

Your next step

→ Send STEP file and/or PDF drawing to: info@malping.de

→ We check geometry and material suitability free of charge — and recommend the optimal material

→ We will respond to your offer or inquiries within 24 hours (working days)

→ malping.de

About the author: Dr.-Ing. Bastian Gaedike is the founder and managing director of Malping GmbH (brand: Materialpinguin) in Neuhausen auf den Fildern. The materials scientist, who holds a doctorate, specializes in the processing of high-performance polymers using FFF and FGF (granulate printing) as well as their CNC post-processing.