PPS-GF20 in 3D printing: Electrical insulating plastic for circuit board frames and electronic applications
- Dr.-Ing. Bastian Gaedike
- 6 days ago
- 4 min read
Why PPS-GF20 is increasingly in demand in the electronics sector
Anyone looking for 3D-printed housing parts, circuit board frames or connector housings in the electronics and power electronics sector quickly encounters a dilemma: Standard thermoplastics such as PA12 or ABS are often insufficient in terms of thermal or chemical properties – PEEK, on the other hand, is expensive and over-dimensioned for many series applications.
This is precisely where PPS-GF20 (polyphenylene sulfide with 20% glass fibers) positions itself as a technically compelling and economically attractive solution. The material combines electrical insulation, flame retardancy, temperature stability up to 220 °C, and excellent chemical resistance – at a fraction of the cost of PEEK.
Malping processes PPS-GF20 using both FFF (filament printing) and FGF granule printing on the AIM3D ExAM 510. For larger circuit board frames or serial parts, granule printing is significantly more cost-effective than filament printing.
Overview of the material properties of PPS-GF20
PPS is a semi-crystalline, high-performance thermoplastic that has been used in the electronics industry for decades as an injection molding compound. The 20% glass fiber reinforcement (GF20) significantly increases stiffness and dimensional stability compared to unfilled PPS.
Electrical and thermal characteristics
• Contact resistance: >10¹⁵ Ω·cm – reliable electrical insulation even under the influence of moisture
• Dielectric constant: ~3.5 at 1 MHz – advantageous for RF-like applications
• Continuous operating temperature: 200–220 °C – sufficient for most PCB assemblies
• Short-term temperature: up to 260 °C – relevant for reflow soldering processes (lead-free solder)
• Flame retardancy: UL 94 V-0 without additives – meets common standards for electronic enclosures
Mechanical properties
• E-modulus: ~9 GPa – significantly stiffer than natural PEEK (~4 GPa), close to PEEK-GF20
• Tensile strength: ~130–150 MPa – suitable for load-bearing frame structures
• Creep tendency: very low – Dimensional stability even under continuous load and heat
• Water absorption: <0.05% – negligible, important for electrical properties
Electronics applications: circuit board frames, connector housings and more
The combination of electrical insulation, flame retardancy and temperature resistance makes PPS-GF20 a prime example material for the following electronics applications in 3D printing:
PCB frames and PCB carriers
PCB frames made of PPS-GF20 reliably insulate PCBs from the housing ground and adjacent assemblies. The high modulus of elasticity prevents warping under thermal load: a common problem with PA-based frames. Unlike milled epoxy resin parts, 3D printing allows undercuts, cable routing, and connector recesses to be integrated into a single component.
Typical application example: Power electronics module with multiple PCBs, where each board is fixed in its own PPS-GF20 frame and electrically separated from the aluminum housing.
Connector housing and contact carrier
PPS-GF20 meets the requirements of IEC 60335 and similar standards for contact carriers without any additional additives. Its low water absorption ensures consistent dielectric properties even in humid environments (e.g., automotive, industrial automation).
• Individual pieces and small series for prototypes and special connections
• Spare parts for discontinued connector housings (Digital Inventory)
• Versatile connectors with multiple contact rows without tooling costs
Insulation bushings, spacers and cable guides
Insulating bushings between screws and PCBs are a classic application. FFF/FGF 3D printing enables the rapid production of customer-specific geometries – from simple cylinders to complex cable entry plates with integrated clip systems.
Heat-dissipating structures (with PPS-CF as an alternative)
For applications requiring both insulation and defined heat dissipation, PPS-CF (carbon fiber reinforced) is a suitable option – however, it then exhibits conductive properties that necessitate separate evaluation. PPS-GF20 remains the material of choice when electrical insulation is the top priority.
PPS-GF20 vs. PEEK: When to use which material?
PEEK is the best-known high-performance polymer in 3D printing – but not always the right one. The following table shows the most important differences for electronics applications:
Characteristic | PPS-GF20 | PEEK (natural) | Relevance of electronics |
continuous temperature | 220 °C | 250 °C | Reflow soldering up to 260 °C* |
E-module | ~9 GPa | ~4 GPa (natural) | Frame's dimensional stability |
Dielectric constant | ~3.5 @ 1 MHz | ~3.2 @ 1 MHz | RF isolation |
Contact resistance | >10¹⁵ Ω·cm | >10¹⁵ Ω·cm | PCB insulation |
Flame retardancy | UL 94 V-0 | UL 94 V-0 | Housing, frame |
Chemical resistance | very good | excellent | Cleaning, flux |
Material costs | ~100 €/kg | 500–700 €/kg | Cost lever |
* Short-term temperatures during reflow soldering require individual testing; PPS-GF20 may reach its limits with lead-free solder (260 °C peak).
When PPS-GF20 is the better choice
• Continuous operation up to 220 °C
• Cost optimization: PPS-GF20 filament costs approximately €100/kg vs. €500–700/kg for PEEK filament
• High stiffness required: PPS-GF20 significantly outperforms natural PEEK in terms of modulus of elasticity.
• Series applications and larger production volumes, where material costs directly impact part costs
• UL 94 V-0 without flame retardant additives
When PEEK is the better choice
• Continuous operation >220 °C or short-term use up to 300+ °C (e.g. directly on power semiconductors)
• Highest chemical resistance, e.g. against aggressive cleaning agents in medical technology
• If standards or specifications explicitly require PEEK
• Biocompatibility requirements (ISO 10993)
If you are unsure: Malping provides technical advice and prepares quotes for both materials for direct comparison.
CNC post-processing
For precise fits on connector pins, screw holes, or PCB surfaces, Malping combines FGF printing with CNC post-processing under one roof. Tolerances down to ±0.05 mm are thus achievable for functionally critical contact surfaces – without outsourcing to a second service provider.
FAQ – Frequently Asked Questions about PPS-GF20 in 3D Printing
Is PPS-GF20 suitable for PCB frames?
Yes – PPS-GF20 offers excellent electrical insulation (>10¹⁵ Ω·cm), UL 94 V-0 flame retardancy and sufficient temperature stability for most electronic applications up to 220 °C continuous use.
When is PEEK a better choice than PPS-GF20?
PEEK is useful at continuous temperatures >220 °C (e.g. reflow soldering environments), highest chemical requirements, or when standards explicitly require PEEK.
What tolerances are achievable?
With CNC post-processing, Malping achieves tolerances down to ±0.05 mm – relevant for precisely fitting connector housings and circuit board frames. Without post-processing, the tolerance is ±0.1 mm.
Is GF20 electrically conductive?
No – glass fibers (GF) are electrically insulating. Only CF variants (carbon fiber reinforced) would be conductive; PPS-GF20 remains an insulating material.
Request PPS-GF20 components – circuit board frames, connector housings, insulation parts
Malping supplies PPS-GF20 components from individual prototypes to small series production – via FFF filament printing or FGF granule printing, optionally with CNC post-processing for fit dimensions.
► Request a quote now, no obligation: info@malping.de
► Request a material comparison of PEEK vs. PPS-GF20
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